Tauvia engineers around the full stack — from AI platform evolution down to rack, power, cooling, network and the data center shell. Multi-vendor validated, standardized and built for maintainability.
Tauvia designs high-density rack architecture for current and future high-power AI platforms, with direct-to-chip liquid cooling and a clear maintenance path.
Product adaptation for B300 / GB300 and future high-power platforms is subject to OEM delivery, certification and validation. Tauvia does not represent confirmed compatibility for unannounced platforms.
A closed, monitored loop from GPU to heat rejection.
A/B feed architecture, UPS and standardized busway support high-density AI loads with maintainability built in.
Pre-fabricated electro-mechanical modules and standardized busway for parallel construction and faster deployment.
Carrier-neutral, 400G-ready fabric with cross-border connectivity for low-latency AI workloads.
DCIM, energy analytics and AI workload telemetry across PUE, rack, power quality, cooling and carbon data.